Package on package design

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Package on package design
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic (like processors) and memory ball grid array (BGA) packages which is used in A5 chip by iphone.There is a standard interface to route signals between different packages. It is shown as following:

Two widely used configurations exist for PoP:
1. Pure memory stacking - two or more memory only packages are stacked on each other
2. Mixed logic-memory stacking - logic (CPU) package on the bottom, memory package on top. For example, the bottom could be an application processor for a mobile phone. The logic package (processors) is on the bottom because it needs many more BGA connections to the motherboard.

Benifits:
  • 1), Mother space saving
  • Minizing track length between different interoperating parts, such as a controller and a memory.
1), faster signal propagation
2), reduced noise and cross-talk
  • Memory is decompled from logic device.
   1), The memory package can be tested separately from the logic package
   2), Only "known good" packages are used in final assembly (if the memory is bad only the memory is thrown away and so on).
   3), The end user (such as makers of mobile phones or digital cameras) controls the logistics.
   4), Because the construction is like Lego (乐高玩具), any mechanically mating top package can be used.
   5), Because the memory only comes into the mix at final assembly, there is no reason for logic suppliers to source any memory. With a
       stacked-die device, the logic provider must buy wafers of memory from a memory supplier.

Reference : http://en.wikipedia.org/wiki/Package_on_package Acessed: Nov 14, 2011.




Comments

  1. Abell Gilbert17 May 2015 at 18:08

    Well, I will use this technique to get the work done easily. Thanks for posting it. packaging design company

    ReplyDelete

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